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INTEGRATED CIRCUITS
DATA SHEET
TDA8578 Dual common-mode rejection differential line receiver
Product specification Supersedes data of November 1993 File under Integrated Circuits, IC01 1995 Dec 15
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
FEATURES * Excellent common-mode rejection up to high frequencies * Elimination of source resistance in the common-mode rejection * Few external components * High supply voltage ripple rejection * Low noise * Low distortion * Protected against electrostatic discharge * AC and DC short circuit safe to ground and VCC * Fast DC settling. QUICK REFERENCE DATA SYMBOL VCC ICC Gv SVRR Vno Zi CMRR PARAMETER supply voltage supply current voltage gain supply voltage ripple rejection noise output voltage input impedance common-mode rejection ratio Rs = 0 VCC = 8.5 V CONDITIONS 5 - -0.5 -55 - 100 - MIN. TYP. 8.5 11 0 -60 3.7 240 80 APPLICATIONS * Audio * Car radio. GENERAL DESCRIPTION
TDA8578
The TDA8578 is a two-channel differential amplifier in a 16 pin DIL or SO package intended to receive line inputs in audio applications requiring a high-level of common-mode rejection. The amplifier has a gain of 0 dB and a low distortion. The device is primarily developed for those car radio applications where long connections between signal sources and amplifiers (or boosters) are necessary and ground noise has to be eliminated.
MAX. 18 14 +0.5 - 5 - - V
UNIT mA dB dB V k dB
ORDERING INFORMATION TYPE NUMBER TDA8578 TDA8578T PACKAGE NAME DIP16 SO16 DESCRIPTION plastic dual in-line package; 16 leads (300 mil); long body plastic small outline package; 16 leads; body width 3.9 mm VERSION SOT38-1 SOT109-1
1995 Dec 15
2
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
BLOCK DIAGRAM FUNCTIONAL DESCRIPTION
TDA8578
VCC 16 INL INL 1 5 12 VCC 8 OUTL
TDA8578
SVRR
INR INR
6 7 9
11
OUTR
The TDA8578 contains two identical differential amplifiers with a voltage gain of 0 dB. The device is intended to receive line input signals. The device has a very high-level of common-mode rejection and it eliminates ground noise. The common-mode rejection keeps constant up to high frequencies. The gain of the amplifiers is fixed at 0 dB. The inputs have a high-input impedance and the output stage is a class AB stage with a low-output impedance. For a large common-mode rejection also at low frequencies, an electrolytic input capacitor at the negative input pin is advised. The input impedance is relative high, this would result in a large settling time of the DC input voltage. Therefore a quick charge circuit is included that charges the input capacitor within 0.2 s. All input and output pins are protected against high electrostatic discharge conditions (4000 V, 150 pF, 150 ).
MBD209
GND
Fig.1 Block diagram.
PINNING SYMBOL INL+ n.c. n.c. n.c. INL- INR- INR+ SVRR GND n.c. OUTR OUTL n.c. n.c. n.c. VCC PIN 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 DESCRIPTION positive input left not connected not connected not connected negative input left negative input right positive input right half supply voltage ground not connected output right output left not connected not connected not connected supply voltage Fig.2 Pin configuration.
INL n.c. n.c. n.c. INL INR INR SVRR 1 2 3 4 TDA8578 5 6 7 8
MBD210
16 V CC 15 14 13 n.c. n.c. n.c.
12 OUTL 11 OUTR 10 9 n.c. GND
1995 Dec 15
3
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VCC IORM Vsc Tstg Tamb Tj HANDLING PARAMETER supply voltage repetitive peak output current AC and DC short-circuit safe voltage storage temperature operating ambient temperature junction temperature CONDITIONS operating - - - -55 -40 - MIN.
TDA8578
MAX. 18 40 18 +150 +85 +150 V
UNIT mA V C C C
Inputs and outputs are protected against electrostatic discharges in normal handling. However, to be totally safe, it is desirable to take normal precautions appropriate to handling integrated circuits. THERMAL CHARACTERISTICS SYMBOL Rth j-a TDA8578 (DIP16) TDA8578T (SO16) PARAMETER thermal resistance from junction to ambient in free air 75 120 K/W K/W VALUE UNIT
DC CHARACTERISTICS VCC = 8.5 V; Tamb = 25 C; in accordance with test circuit (see Fig.3); unless otherwise specified. SYMBOL VCC ICC VO tset Note 1. The DC output voltage with respect to ground is approximately 0.5VCC. PARAMETER supply voltage supply current DC output voltage DC input voltage settling time note 1 CONDITIONS 5 - - - MIN. TYP. 8.5 11 4.3 0.2 MAX. 18 14 - - V mA V s UNIT
1995 Dec 15
4
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8578
AC CHARACTERISTICS VCC = 8.5 V; f = 1 kHz; Tamb = 25 C; in accordance with test circuit (see Fig.3); unless otherwise specified. SYMBOL Gv cs Gv fL fH Zi Zo Vi(max) Vno VCM(rms) CMRR SVRR THD PARAMETER voltage gain channel separation channel unbalance low frequency roll-off high frequency roll-off input impedance output impedance maximum input voltage noise output voltage common-mode input voltage (RMS value) common-mode rejection ratio supply voltage ripple rejection total harmonic distortion Rs = 5 k Rs = 0 ; note 3 note 4 note 5 Vi = 1 V Vi = 1 V; f = 20 Hz to 20 kHz THDmax Notes 1. Frequency response externally fixed by the input coupling capacitors. 2. Noise output voltage is measured in a bandwidth of 20 Hz to 20 kHz (unweighted). 3. The common-mode rejection ratio is measured at the output, with a voltage source of 1 V (RMS), in accordance with test circuit (see Fig.3), while VINL and VINR are short-circuited. Frequencies between 100 Hz and 100 kHz. 4. Ripple rejection is measured at the output, with Rs = 2 k; f = 1 kHz and a ripple amplitude of 2 V (p-p). 5. Ripple rejection is measured at the output, with Rs = 0 up to 2 k and f = 100 Hz to 20 kHz; maximum ripple amplitude of 2 V (p-p). total harmonic distortion at maximum output current Vi = 1 V; RL = 150 THD = 1% Rs = 0 ; note 2 -1 dB; note 1 -1 dB Rs = 5 k CONDITIONS MIN. -0.5 70 - 20 20 100 - - - - 66 - 55 - - - - 0 80 - - - 240 - 2 3.7 - 70 80 65 60 0.02 - - TYP. - 0.5 - - - 10 - 5 1 - - - - - 0.1 1 MAX. +0.5 UNIT dB dB dB Hz kHz k V V V dB dB dB dB % % %
1995 Dec 15
5
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8578
8.5 V Rs V INL 5 k 220 nF 16 1 12 5 22 F VCC 2.2 F OUTL 100 nF
TDA8578
SVRR 6 8
47 F
V CM
V INR 11 Rs 5 k 220 nF 7 9
2.2 F OUTR RL 10 k RL 10 k
MBD218
Fig.3 Test circuit.
10 1
MBD215
THD (%)
10 2
10
3
10
10 2
10 3
10 4
f (Hz)
10 5
Fig.4 Total harmonic distortion as a function of frequency; Vi = 1.0 V (RMS). 1995 Dec 15 6
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8578
MBD216
0 CMR (dB) 20
40
(1) 60 (2) 80 (3) 100 10 (1) Rs = 5 k. (2) Rs = 2 k. (3) Rs = 0 .
10 2
10 3
10 4
f (Hz)
10 5
Fig.5 Common-mode rejection as function of frequency; VCM = 1.0 V (RMS).
1
MBD213
THD (%)
10
1
10 2
10 3 10
10 2
10 3
V i (rms) (mV)
10 4
Fig.6 Total harmonic distortion as a function of input voltage; f = 1 kHz.
1995 Dec 15
7
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8578
MBD214
40 CMR (dB) 50
60
70
80
90 100
300
500
700
900
1100
V CM (rms) (mV)
1300
Fig.7 Common-mode rejection as a function of common-mode input voltage; f = 1 kHz; Rs = 0 .
MBD211
0 CMR (dB) 20
40
60
(1) (2) (3)
80
100 10 (1) C2 = 22 F. (2) C2 = 47 F. (3) C2 = 100 F.
10 2
10 3
10 4
f (Hz)
10 5
Fig.8 Common-mode rejection as a function of frequency; VCM = 1.0 V. 1995 Dec 15 8
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8578
30 SVR (dB) 40
MBD212
50
60
70 10
10 2
10 3
f (Hz)
10 4
Vripple = 2 V (p-p); Rs = 2 k.
Fig.9 Supply voltage ripple rejection as a function of frequency.
APPLICATION INFORMATION
8.5 V Rs V INL 5 k 220 nF 16 1 12 5 10 F 10 F 6 V INR 11 Rs 5 k 220 nF 7 9 RL 10 k RL 10 k 2.2 F OUTR VCC 2.2 F OUTL 100 nF
TDA8578
SVRR 8
47 F
MBD217
Fig.10 Application circuit balanced signal source.
1995 Dec 15
9
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
PACKAGE OUTLINES DIP16: plastic dual in-line package; 16 leads (300 mil); long body
TDA8578
SOT38-1
D seating plane
ME
A2
A
L
A1
c Z e b1 b 16 9 MH wM (e 1)
pin 1 index E
1
8
0
5 scale
10 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.020 A2 max. 3.7 0.15 b 1.40 1.14 0.055 0.045 b1 0.53 0.38 0.021 0.015 c 0.32 0.23 0.013 0.009 D (1) 21.8 21.4 0.86 0.84 E (1) 6.48 6.20 0.26 0.24 e 2.54 0.10 e1 7.62 0.30 L 3.9 3.4 0.15 0.13 ME 8.25 7.80 0.32 0.31 MH 9.5 8.3 0.37 0.33 w 0.254 0.01 Z (1) max. 2.2 0.087
Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT38-1 REFERENCES IEC 050G09 JEDEC MO-001AE EIAJ EUROPEAN PROJECTION
ISSUE DATE 92-10-02 95-01-19
1995 Dec 15
10
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
TDA8578
SO16: plastic small outline package; 16 leads; body width 3.9 mm
SOT109-1
D
E
A X
c y HE vMA
Z 16 9
Q A2 A1 pin 1 index Lp 1 e bp 8 wM L detail X (A 3) A
0
2.5 scale
5 mm
DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 1.75 0.069 A1 0.25 0.10 A2 1.45 1.25 A3 0.25 0.01 bp 0.49 0.36 c 0.25 0.19 D (1) 10.0 9.8 E (1) 4.0 3.8 0.16 0.15 e 1.27 0.050 HE 6.2 5.8 L 1.05 Lp 1.0 0.4 0.039 0.016 Q 0.7 0.6 0.028 0.020 v 0.25 0.01 w 0.25 0.01 y 0.1 0.004 Z (1) 0.7 0.3 0.028 0.012
0.010 0.057 0.004 0.049
0.019 0.0100 0.39 0.014 0.0075 0.38
0.244 0.041 0.228
8 0o
o
Note 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. OUTLINE VERSION SOT109-1 REFERENCES IEC 076E07S JEDEC MS-012AC EIAJ EUROPEAN PROJECTION
ISSUE DATE 95-01-23 97-05-22
1995 Dec 15
11
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
SOLDERING Introduction There is no soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and surface mounted components are mixed on one printed-circuit board. However, wave soldering is not always suitable for surface mounted ICs, or for printed-circuits with high population densities. In these situations reflow soldering is often used. This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our "IC Package Databook" (order code 9398 652 90011). DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C; solder at this temperature must not be in contact with the joint for more than 5 seconds. The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg max). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron (less than 24 V) to the lead(s) of the package, below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds. SO REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages. Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement.
TDA8578
Several techniques exist for reflowing; for example, thermal conduction by heated belt. Dwell times vary between 50 and 300 seconds depending on heating method. Typical reflow temperatures range from 215 to 250 C. Preheating is necessary to dry the paste and evaporate the binding agent. Preheating duration: 45 minutes at 45 C. WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed: * A double-wave (a turbulent wave with high upward pressure followed by a smooth laminar wave) soldering technique should be used. * The longitudinal axis of the package footprint must be parallel to the solder flow. * The package footprint must incorporate solder thieves at the downstream end. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Maximum permissible solder temperature is 260 C, and maximum duration of package immersion in solder is 10 seconds, if cooled to less than 150 C within 6 seconds. Typical dwell time is 4 seconds at 250 C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonallyopposite end leads. Use only a low voltage soldering iron (less than 24 V) applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300 C. When using a dedicated tool, all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C.
1995 Dec 15
12
Philips Semiconductors
Product specification
Dual common-mode rejection differential line receiver
DEFINITIONS Data sheet status Objective specification Preliminary specification Product specification Limiting values
TDA8578
This data sheet contains target or goal specifications for product development. This data sheet contains preliminary data; supplementary data may be published later. This data sheet contains final product specifications.
Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Where application information is given, it is advisory and does not form part of the specification. LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale.
1995 Dec 15
13

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